This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
Subscribe to:
Post Comments (Atom)
The Colt 1911 Pistol (Osprey Weapon 9)
Download The Colt 1911 Pistol (Osprey Weapon 9) First used in combat during the Punitive Expedition into Me...
-
Download Drawdown: The Most Comprehensive Plan Ever Proposed To Reverse Global Warming The 100 most substan...
-
Download Invision Power Board 2: A User Guide. This book is your guide to configuring, managing and maintai...
-
Download The Grant Cardone Rebuttal Manual 200+ Page Rebuttal Manual. Learn to handle any objection with th...
No comments:
Post a Comment